Via demonstrates new generation of UMPCs

Developer of silicon chip technologies and PC platform solutions, Via Technologies, has announced that the company has taken major steps to meet the growing global demand of Ultra Mobile PC devices. These are based on 'Origami' platform developed by Microsoft that combines the functionality of PDA and a PC with advanced connectivity features.

 

According to Richard Brown, vice president of Corporate Marketing, Via Technologies, "With our new Via C7-M ULV (Ultra Low Voltage) processor platform we are taking major steps to provide the right solution for enabling the development of these innovative new devices, combining the best performance per watt operation in the industry with the smallest silicon footprint in the market." 
 
Via first demonstrated the new generation UMPC devices powered by the Via C7-M ULV processor at CeBIT, Hannover, in March 2006, including the 'SmartCaddie' from Japan-based PBJ, which has already launched this product in the Japanese market.
 
Via is also seeing growing demand for Via C7-M ULV processor-based UMPCs in all other major global markets, and expects to see such products launched by partners in India in the second half of 2006.

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